Mono T-3002-PRO Die Bonder & COMPONENT PLACER

the PRO incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height.

Together with superior ergonomics the PRO platform is the industry’s most sophisticated system in its class and with the new PC software even easier to operate.

The T-3002-PRO is equiped with Tresky's die ejector system for pick-up from wafer.

Advanced multi functional Die Bonder with superior ergonomic design and programmable, high accuracy Z

Drive and bonding force control.

Applications :-

Die Attach, Die Sorting, Flip-Chip, 3D Packaging, MEMS, MOEMS, VCSEL, Photonics, Ultrasonic, Thermosonic,

RFID, Sensor Assembly, Adhesive Bonding, UV Curing, Eutectic Bonding (AuAu, AuSn, .....), ......